Subventions et des contributions :

Titre :
Design and Optimization of Circuit Board Enclosure using Additive Manufacturing Techniques
Numéro de l’entente :
CARD1
Valeur d'entente :
25 000,00 $
Date d'entente :
22 mars 2018 -
Organisation :
Conseil de recherches en sciences naturelles et en génie du Canada
Location :
Ontario, Autre, CA
Numéro de référence :
GC-2017-Q4-01639
Type d'entente :
subvention
Type de rapport :
Subventions et des contributions
Informations supplémentaires :

Subvention ou bourse octroyée s'appliquant à plus d'un exercice financier (2017-2018 à 2018-2019).

Nom légal du bénéficiaire :
Sheikhzadeh, Mehdi (Lambton College of Applied Arts and Technology)
Programme :
Subventions d'engagement partenarial pour les collèges
But du programme :

OES Inc. is a leading London, ON based provider of technology solutions in Electronic Manufacturing & Design Services that has developed a system for detection of crimping defects in the production of automotive wiring harnesses, which has benefits in harness reliability. Currently, there are two housings containing sensors and electronics that are custom fabricated and are too costly for volume manufacturing.x000D
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The proposed project in collaboration with Lambton College's Bluewater Technology Access Centre will investigate the development of a case that can be fabricated by injection moulding that will be much more cost effective and that can be fabricated in volume. The research team will focus on translating the current OES design into one that can be fabricated using injection mouldingx000D
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The project will result in accelerating the commercialization cycle for the CQS technology and enable them to economically start shipping demonstration units to global manufacturers of wiring harnesses. The technology will give them a competitive advantage and lower cost will increase the OES market share, allowing them to compete in the cut throat automotive market. This ultimately will provide benefits for Canada, providing economic and exporting impact.