Subventions et des contributions :

Subvention ou bourse octroyée s'appliquant à plus d'un exercice financier (2017-2018 à 2018-2019).

This Engage project will focus on the investigation of possible methodologies of automating placement of partsx000D
to be plated on plating line racks. The utmost aim of doing this investigation is two-fold: (i) precise andx000D
detailed reporting of robotic manipulation needs for KEI plating lines and possible solutions; and (ii) forming ax000D
base for follow-up research and development of robotic manipulator systems for racking in such electroplatingx000D
lines. The final outputs of the project will be a detailed report on robotic manipulation needs on KEI platingx000D
lines and possible solutions, a virtual model and design details of an automated robotic racking system basedx000D
on the identified high fidelity system model, and conceptual design of a robotic manipulation system prototype.x000D
The obtained virtual system model will also be a key tool for later research studies on development of an actualx000D
high performance automated robotic system for the use of KEI.