Subventions et des contributions :

Titre :
Optimization of next generation electroformed flex-tubings for hydraulic servo valves
Numéro de l’entente :
CRDPJ
Valeur d'entente :
256 500,00 $
Date d'entente :
13 déc. 2017 -
Organisation :
Conseil de recherches en sciences naturelles et en génie du Canada
Location :
Alberta, Autre, CA
Numéro de référence :
GC-2017-Q3-00387
Type d'entente :
subvention
Type de rapport :
Subventions et des contributions
Informations supplémentaires :

Subvention ou bourse octroyée s'appliquant à plus d'un exercice financier (2017-2018 à 2020-2021).

Nom légal du bénéficiaire :
Birss, Viola (University of Calgary)
Programme :
Subventions de recherche et développement coopérative - projet
But du programme :

This Collaborative Research and Development Grant proposal addresses strategies to dramatically improve the service life of critical components within prototype Honeywell Aerospace (Honeywell) electro-hydraulic servo valves (EHSV). Supported strongly by Honeywell Aerospace, Honeywell Engines, Systems & Services, Slemon Park, Prince Edward Island (Honeywell P.E.I.) and STENTECH (Mississauga) (StenTech), the proposed research involves the electrodeposition of a porous metal film on top of an electroformed, flexible metal tubing system. A fuel tolerant, vibration damping elastomer would then be incorporated into the pore structure in order to minimize vibration propagation through this valve component. This work will require intensive research on electrodepositing a variety of porous nickel structures, screening them for strength and adhesion, forming elastomer composites and screening the composites for vibration damping behavior. Best performing structures would be incorporated into electroformed Co-Ni tubes and related structures. Ultimately, this component would be implemented within the torque motor of the next generation of Honeywell's EHSVs. This partnership is based on the metals electrodeposition expertise of the Birss group at the University of Calgary (U Calgary), their close collaborative experience with Honeywell, and the willingness of StenTech to seek new potential markets for their electroforming technology, and implementation of this approach by a third party original equipment manufacturer (OEM). This proposal addresses a concept-to-implementation strategy for bringing a product to market. The proposed research will therefore provide a cost effective and more durable EHSV for the aviation industry. By doing so, this project has the potential to bring OEM manufacturing to Canada, and because of an increased share in the EHSV market, this will increase the need for service expertise at the Honeywell P.E.I. aviation facility. Both of these outcomes will support high technology jobs in Canada and directly impact economic competitiveness for Canadian-based companies.