Subventions et des contributions :

Titre :
Development of a Computationally Efficient Lumped Parameter Thermal Network Model for Accurate Thermal Analysis of Permanent Magnet Synchronous Machines
Numéro de l’entente :
EGP
Valeur d'entente :
25 000,00 $
Date d'entente :
12 juil. 2017 -
Organisation :
Conseil de recherches en sciences naturelles et en génie du Canada
Location :
Ontario, Autre, CA
Numéro de référence :
GC-2017-Q2-00120
Type d'entente :
subvention
Type de rapport :
Subventions et des contributions
Informations supplémentaires :

Subvention ou bourse octroyée s'appliquant à plus d'un exercice financier (2017-2018 à 2018-2019).

Nom légal du bénéficiaire :
Kar, Narayan (University of Windsor)
Programme :
Subventions d'engagement partenarial pour les universités
But du programme :

TM4 Inc. (TM4) is a Quebec based company developing and manufacturing electric and hybrid powertrainx000D
systems suitable for the commercial, automotive and recreational vehicle markets. TM4 has approached thex000D
University of Windsor to resolve the challenge in thermal simulation of electric motors to be incorporated intox000D
their current vehicle simulator. Through this collaborative project, the students of the University of Windsorx000D
will be closely working with the engineers of TM4 to develop a computationally efficient model forx000D
surface-mounted permanent magnet machines with thermal characterization capability. Then, this model willx000D
be integrated into the vehicle simulator to understand the powertrain limits manufactured by TM4 Inc. Thex000D
proposed model should be able to run in a hardware-in-loop (HIL) real-time simulation environment to assist inx000D
motor control development as well. The success of this project will enable accurate and fast demonstration ofx000D
TM4's solutions for electric powertrain systems to their local and global customers and expand their market.x000D
This project will also lead to professionally competent skill development with respect to the postgraduatex000D
students, possible conference and journal publications and a patent.