Subventions et des contributions :

Subvention ou bourse octroyée s'appliquant à plus d'un exercice financier (2017-2018 à 2018-2019).

Advanced photonic devices are at the basis of optical telecommunication networks and data centres. Thesex000D
devices are built from complex materials structures, involving several fabrication steps and operate in harshx000D
conditions. Knowledge of the structure of these materials is key for developing new devices and understandingx000D
the evolution and degradation of devices during fabrication and operation. In this project we investigatex000D
components of photonics integrated circuits using advanced structural and chemical characterization techniquesx000D
with high spatial resolution. We will develop advanced transmission electron microscopy, electron energy lossx000D
spectroscopy, and surface analysis methods to characterize, at different lengthscales -from nanometers to thex000D
atomic level- the composition and structure of photonic devices. Using these methodologies, we will provide tox000D
the industrial partner, ArtIC Photonics, understanding of the photonic integrated circuits they produce, thex000D
evolution of nanoscale components of these devices during fabrication, and the degradation of these devicesx000D
during operating conditions.