Subventions et des contributions :

Titre :
Microelectromechanical Low-power Strain Sensor for Structural Health Monitoring Applications
Numéro de l’entente :
EGP2
Valeur d'entente :
12 500,00 $
Date d'entente :
22 mars 2018 -
Organisation :
Conseil de recherches en sciences naturelles et en génie du Canada
Location :
Québec, Autre, CA
Numéro de référence :
GC-2017-Q4-01329
Type d'entente :
subvention
Type de rapport :
Subventions et des contributions
Informations supplémentaires :

Subvention ou bourse octroyée s'appliquant à plus d'un exercice financier (2017-2018 à 2018-2019).

Nom légal du bénéficiaire :
Nabki, Frederic (École de technologie supérieure)
Programme :
Subvention d'engagement partenarial Plus pour les universités
But du programme :

Strain sensors suited for the structural health monitoring (SHM) of airplanes are often not miniaturised orx000D
require significant amounts of power, leading to difficulties in accessing constrained locations, prohibitivelyx000D
heavy cabling, and frequent and expensive battery maintenance. Microelectromechanical systems (MEMS) canx000D
reduce the size and power consumption of these sensors. However, the associated sensing electronics requirex000D
significant amounts of power to condition the analog signals from the MEMS transducer.x000D
To resolve this, IPR inc. is proposing a digital-output MEMS transducer design, along with the monitoringx000D
low-power electronics, that is tailored for SHM of airplanes in a compact form-factor and low-power signalingx000D
scheme. IPR's MEMS transducer is based on a direct contact structure that allows for on/off type of detectionx000D
of a strain variation that moves a shuttle mass. This unique and effective solution will allow IPR to create anx000D
affordable and power efficient strain sensing SHM system. However, the current solution has metx000D
micro-fabrication yield issues and questions remain regarding its contact-based sensing scheme. This requiresx000D
the current strain transducer design to be revisited and its implementation in a stable and robust commercialx000D
MEMS fabrication process. IPR wants to continue its collaboration with Prof. Frederic Nabki at ETS throughx000D
this Engage Plus project to refine the MEMS strain sensor design proposed in the previous Engage project andx000D
characterise the initial prototypes fabricated. This transducer will later be integrated within IPR's customx000D
low-power interface electronics to implement a complete strain sensing system for SHM.x000D
This project is a key building block of IPR's low-power and compact strain sensor, and will be a springboardx000D
towards a leadership market position. The innovative MEMS device resulting from this project will ultimatelyx000D
enable the implementation of novel network of sensors well-suited to various traditionally inaccessiblex000D
environments. This project will provide training for HQP (one research professional, one master's student an