Subventions et des contributions :

Titre :
Development of robust self-healable heterogeneous crosslinked films
Numéro de l’entente :
EGP
Valeur d'entente :
25 000,00 $
Date d'entente :
7 mars 2018 -
Organisation :
Conseil de recherches en sciences naturelles et en génie du Canada
Location :
Québec, Autre, CA
Numéro de référence :
GC-2017-Q4-01374
Type d'entente :
subvention
Type de rapport :
Subventions et des contributions
Informations supplémentaires :

Subvention ou bourse octroyée s'appliquant à plus d'un exercice financier (2017-2018 à 2018-2019).

Nom légal du bénéficiaire :
Oh, JungKwon (Université Concordia)
Programme :
Subventions d'engagement partenarial pour les universités
But du programme :

In recent years the development of self-healable thermosets has drawn significant efforts from both academiax000D
and industry. Due to the built-in ability to recover their material properties after physical damage, thesex000D
thermosets can resist catastrophic failure thus extending their lifetime. Furthermore, self-healing technologyx000D
can improve the recyclability of conventional thermosets, thereby conserving fossil fuels. However, mostx000D
self-healable networks have been designed to be fairly soft because rapid void-filling ability to flow to fill thex000D
damaged parts.x000D
In collaboration with Dural, a division of Multibond Inc, this proposed research aims to develop robustx000D
crosslinked networks exhibiting enhanced mechnical properties, while retaining effective self-healability.x000D
Compared with conventional physical blending, our effective approach centers on covalent incorporation ofx000D
inorganic nanoparticles (diameter < 10 nm) into self-healable matrix through a novel block copolymerx000D
technology. Consequently, the nanoparticles will be uniformly and covalently distributed in the crosslinkedx000D
thermosets. Our approach can offer versatility toward the development of self-healable networks exhibiting notx000D
only effective self-healability and high mechanical property but also dimensional and thermal stability andx000D
solvent resistance common to conventional thermosets.